Electric field-induced chemical locomotion of conducting objects. Synthetically chemical-electrical mechanism for controlling large scale reversible deformation of liquid metal objects. Electrochemically induced actuation of liquid metal marbles. Diverse transformations of liquid metals between different morphologies. A fast liquid-metal droplet microswitch using EWODdriven contact-line sliding. Surface-tension-driven microactuation based on continuous electrowetting. Electrowetting-based actuation of liquid droplets for microfluidic applications. Characterization of nontoxic liquid-metal alloy galinstan for applications in microdevices. Liquid metal as connecting or functional recovery channel for the transected sciatic nerve.
Compatible hybrid 3D printing of metal and nonmetal inks for direct manufacture of end functional devices. Predicting macroscopic thermal expansion of metastable liquid metals with only one thousand atoms. Phase-field simulation of dendritic growth in a forced liquid metal flow coupling with boundary heat flux. IEEE T Comp Pack Man, 2014, 1: 459–464ĭu L, Zhang R, Zhang L. Blade heat dissipator with room-temperature liquid metal running inside a sheet of hollow chamber. A liquid metal cooling system for the thermal management of high power LEDs. A powerful way of cooling computer chip using liquid metal with low melting point as the cooling fluid. Thermal effects in packaging high power light emitting diode arrays. ACM Sigmetrics Perform Evaluation Rev, 2012, 40: 175–186Ĭhristensen A, Graham S. Renewable and cooling aware workload management for sustainable data centers. The present work suggests an important way to make highly compact chip cooling device, which can be flexibly extended into a wide variety of engineering areas. Several situations to simulate the practical working of the device were experimentally explored and a theoretical thermal resistance model was established to evaluate its heat transfer performance. Further experiments demonstrated that the cooling device could effectively maintain the temperature of a hotpot (3.15 W/cm 2) below 55✬ with an extremely small power consumption rate (0.8 W). This enables the liquid metal sphere and its surrounding aqueous solution to be quickly accelerated to a large speed under only a very low electric voltage.
Particularly, the electrically induced actuation effect of liquid metal was introduced as the only flow driving strategy, which significantly simplified the whole system design. Here, through combining the individual merits from both the liquid metal with high conductivity and water with large heat capacity, we proposed and demonstrated a new conceptual cooling device that integrated hybrid coolants, radiator and annular channel together for chip thermal management. In addition, the high cost by taking too much amount of liquid metal into the device also turns out to be a big concern for practical purpose. However, its thermal capacity is somewhat lower than that of water, which may restrict the overall cooling performance. As an alternative, the room temperature liquid metal was increasingly emerging as an important coolant to realize much stronger enhanced heat transfer. As the most classical coolant in a convective heat transfer process, water has been widely adopted which however inherits with limited thermal conductivity and relies heavily on mechanical pump. Heat dissipation of electronic devices keeps as a tough issue for decades.
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